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Semiconductor Supplier Seeks Clarification Under FDII, GILTI Regs

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Semiconductor Supplier Seeks Clarification Under FDII, GILTI Regs

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Comments of ON Semiconductor Corporation

On the
Deduction for Foreign-Derived Intangible Income
and Global Intangible Low-Taxed Income

84 Fed. Reg. 8188 (March 6, 2019)
[REG-104464-18]
RIN 1545–B055

ON Semiconductor Corporation appreciates the opportunity to comment to the Treasury Department and the Internal Revenue Service on the proposed regulations on the deductions for foreign-derived intangible income ("FDII") and global intangible low-taxed income ("GILTI") pursuant to section 250 (the "Proposed Regs"). 84 Fed. Reg. 8,188 (March 6, 2019).

ON Semiconductor, headquartered in Phoenix, Arizona, is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient connectivity, sensing, power management, analog, logic, timing, discrete, and custom devices for use in automotive, communications, computing, consumer, industrial, medical and aerospace/defense applications. More information about ON Semiconductor is available at www.onsemi.com.

ON Semiconductor conducts operations globally. Generally, ON Semiconductor engages in R&D and design activities in the U.S., along with a significant amount of wafer fabrication (also referred to as "front-end" manufacturing1). These wafers are then sold to a wholly owned foreign subsidiary, which engages with related and unrelated foreign manufacturers to perform "back-end" manufacturing2 and which then sells to foreign customers who incorporate the finished semiconductor product in their manufacturing processes.

The company's front end operations include factories in Idaho, Maine, New York, Oregon, and Pennsylvania, which is more states than any other U.S. semiconductor company.3 The company also recently announced a significant expansion of its U.S. manufacturing base with its acquisition of a front end facility in East Fishkill, New York that will process 12 inch diameter wafers, each of which can produce over double the number of chips compared to the 8 inch wafers used at the company's current factories.4

The intention of Congress, through the enactment of H.R. 1 (f/k/a the Tax Cuts and Jobs Act), was to encourage U.S. companies to bring back ("repatriate") intangible property ("IP") and manufacturing to the U.S. The newly created deduction for FDII was one incentive intended to encourage such repatriation. ON Semiconductor is actively evaluating the economic ownership of its IP rights, in primary part due to the potential benefits provided by FDII. However, the Proposed Regs. introduce significant administrative burdens as well as several areas of uncertainty. The Proposed Regs., as drafted, would have a significant impact on any decision by ON Semiconductor to restructure IP ownership and a potentially adverse impact on any decision to repatriate IP ownership to the U.S.

As a result of the administrative burden from, and uncertainty of, the Proposed Regs., ON Semiconductor respectfully requests that Treasury:

  • Align the definition of foreign use for income from intangible property under §1.250(b)-4(e) with the definition of foreign use for general property under §1.250(b)-4(d)(2);

  • Amend the "end user" language in §1.250(b)-4(e)(2) to define the term "end user" to be either (a) customers who further manufacture the product or (b) the ultimate end consumer (e.g. the customer's customer);

  • Provide additional language to further define "physical and material change" in §1.250(b)-4(d)(2);

  • Clarify the language of and provide examples in §1.250(b)-6(b)(5)(ii) to make clear that, for instance, a product sold from a US company to its foreign subsidiary and used by the foreign subsidiary to manufacture finished products meets the definition of "component" without regard to the definition of "component" in §1.250(b)-4(d)(2)(iii)(C);

  • Include an election to permit the sale of product to an unrelated person that occurs after the FDII filing date pursuant to §1.250(b)-6(c)(1)(i) to be claimed as a carryforward and deducted on a future return rather than requiring the filing of an amended return; and,

  • Amend the documentation requirements for determining the status of a customer as a "foreign person" under §1.250(b)-4(c)(2) to include documents more readily obtainable in the ordinary course of business such as commercial invoices, packaging slips, purchase orders, or bills of lading.

DEFINITION OF "FOREIGN USE" FOR INTANGIBLE INCOME

The preamble to the Proposed Regs. cites footnote 1522 of the Conference Report that accompanied H.R. 1 to conclude that because intangible property is not subject to manufacture, assembly, or processing and because no other discussion appears in the Conference Report with respect to intangible property, income from intangible property should not be eligible for "foreign use" based on further foreign manufacturing. However, Section 250(b)(5)(E) defines "sale", "sell", and "sold" to include any lease, license, exchange, or other disposition. ON Semiconductor believes that Footnote 1522 was intended to clarify that all income from a sale of property (including income from royalties or licensing fees) would be eligible for FDII if the property sold was subject to further manufacturing outside the United States. A royalty paid by a foreign related party to a US company for the right to make, use, and/or sell property should be eligible for FDII if such property ultimately sold by the foreign related party to a foreign customer is subject to further manufacturing outside the United States. ON Semiconductor respectfully requests that Treasury align the definition of foreign use for income from intangible property under §1.250(b)-4(e) with the definition of foreign use for general property under §1.250(b)-4(d)(2).

Example: DC, a domestic corporation, fabricates semiconductor wafers. The wafers are sold to a related foreign party, CFC, incorporated under the laws of foreign country X CFC undertakes manufacturing activities to produce a finished semiconductor product. CFC sells the finished semiconductor product to FC, an unrelated party incorporated under the laws of foreign country Y. CFC pays a royalty to DC for the right to make, use, and/or sell finished products. FC's manufacturing process is substantial in nature and is generally considered to constitute the manufacture or production of cell phones, and not the manufacture of semiconductor products. The semiconductor products purchased from CFC have been subject to a physical and material change by FC in foreign country Y.

Result: The semiconductor products sold by CFC to FC meet the definition of foreign use as they have been manufactured, assembled or processed outside the U.S. Accordingly, the royalty income earned by DC qualifies under §1.250(b)-4(e) for foreign use.

DEFINITION OF "END USER" FOR PURPOSES OF INCOME FROM INTANGIBLE PROPERTY

Proposed Reg. §1.250(b)-(4)(e)(2) states that "a sale of intangible property is for a foreign use only to the extent that the intangible property generates revenue from exploitation outside the United States". The Proposed Regs. further specify that "the intangible property is exploited at the location of the end user when the product is sold to the end user" (emphasis added). However, the Proposed Regs. do not define "end use and do not appear to contemplate business models where a taxpayer sells exclusively to original equipment manufacturers ("OEMs") and/or other customers who use the purchased product to engage in further manufacturing for subsequent sale of end products to consumers.

The "end user" of ON Semiconductor's product is a customer who engages in further manufacturing. ON Semiconductor does not generally have access to data from its OEM customers that would document the location of the consumer upon final sale by the OEM (or the customer of the OEM)5. Treasury should amend the language in the Proposed Regs. under §1.250(b)-4(e)(2) to define "end user" to include a customer who engages in further manufacturing. Alternatively, Treasury should consider eliminating the term "end user" and instead find an appropriate alternative such as "the location of the first unrelated customer who consumes the product or uses the product in further manufacturing processes when the product is sold to such customer."

Example: DC, a domestic corporation, fabricates semiconductor wafers. The wafers are sold to a related foreign party, CFC, incorporated under the laws of foreign country X CFC undertakes manufacturing activities to produce a finished semiconductor product. CFC sells the finished semiconductor product to FC, an unrelated party incorporated under the laws of foreign country Y, who uses the finished semiconductor product in its manufacturing process to produce cell phones. CFC pays a royalty to DC for the right to make, use, and sell finished products. FC manufacturing process is substantial in nature and is generally considered to constitute the manufacture or production of cell phones, and not the manufacture of semiconductor products. The semiconductor products purchased by FC from CFC have been subject to a physical and material change.

Result: FC is the end user of the finished product sold by CFC. Accordingly, the royalty income earned by DC qualifies under § 1.250(b)-4(e) for a foreign use.

DEFINITION OF "PHYSICAL AND MATERIAL CHANGE" FOR FOREIGN USE

Pursuant to §1.250(b)-4(d)(2), the sale of general property is for a foreign use if the property is subject to manufacture, assembly, or other processing outside the United States such that the property either (1) is physically and materially changed or (2) is incorporated as a component into a second product. ON Semiconductor recommends that Treasury provide additional language to further define "physical and material" change. The additional language should set out that the "physical and material" change test is met where general property is subject to processing or manufacturing activities that are substantial in nature and that are generally considered to constitute the manufacturing or production of property that is substantially different than the property which was sold to the customer6. This language is consistent with language used in the regulations under §9547. This language could be illustrated by the following example.

Example: DC, a domestic corporation, manufactures finished semiconductor products. The finished semiconductor products are sold to an unrelated foreign party, FC, incorporated under the laws of foreign country X. FC manufactures cell phones. FC will incorporate the finished semiconductor products purchased from DC in its manufacturing process. FC's manufacturing process is substantial in nature and is generally considered to constitute the manufacture or production of cell phones, and not the manufacture of finished semiconductor products. The finished semiconductor products purchased from DC have been subject to a physical and material change and are not the same product as the cell phones sold by FC. Thus, they qualify as manufactured, assembled or processed outside the Us.

DEFINITION OF "COMPONENT" FOR RELATED PARTY SALES

ON Semiconductor respectfully requests Treasury to clarify the language of and provide additional examples in §1.250(b)-6, as the guidance contained in §1.250(b)-6(b)(5) is not clear. In particular, the distinction between §1.250(b)-6(b)(5)(ii) and §1.250(b)-6(b)(5)(iii) should be clarified. For example, is the sale of a wafer manufactured in the U.S. and sold to a CFC who engages in further manufacturing and then sells to unrelated customers for use outside the U.S. controlled by §1.250(b)-6(b)(5)(ii) or by §1.250(b)-6(b)(5)(iii)? Is the wafer "property sold [as] a component of property", or, rather, is the wafer "property used in connection with the property sold"? The better interpretation of the Proposed Regs. would appear to support the conclusion that this example would be governed by §1.250(b)-6(b)(5)(ii).

Further, ON Semiconductor recommends including the following language from the preamble to the Proposed Regs. in the Final Regulations themselves:

"For purposes of this rule, whether property is a component of another property that is subsequently sold in an unrelated party transaction is determined without regard to the rule defining a "component" for purposes of determining whether general property is subject to manufacturing, assembly, or other processing, as described in [part III(C)(3)(a) of this Explanation of Provisions section]."8

Because of the emphasis on the distinction between "physically and materially changed" and "incorporated as a component" contained in §1.250(b)-4(d)(2) (discussed above), it is critical that the final §250 regulations in §1.250(b)-6(b)(5) specifically stipulate that the classification under §1.250(b)-6(b)(5) has no bearing on the classification under §1.250(b)-4(d)(2).

Example: In Year 1, DC, a domestic corporation, fabricates semiconductor wafers. The wafers are sold to a related foreign party, CFC, incorporated under the laws of foreign country X. In Year 1, CFC undertakes manufacturing activities to produce a finished semiconductor product. In Year 1, CFC sells the finished semiconductor product to FC, an unrelated party incorporated under the laws of foreign country Y. CFC's sale to FC otherwise meets the requirements under §1.2.50(b)-4(c) and (d).

Result: CFC's sale to FC qualifies as an unrelated party transaction under §1.250(b)-6(b)(5)(ii).

ELECTION TO TREAT FDII SALES AS A CARRYFORWARD

ON Semiconductor respectfully requests Treasury include an election in §1.250(b)-6(c)(i) pursuant to which companies can claim FDDEI related party sales that are sold to a third party after the FDII filing date on future tax returns (in the respective taxable year in with the sale to the third party occurs) in lieu of filing an amended return. An amended return filing could create significant administrative burdens and undue hardships for some taxpayers. In addition to the complexities and costs of filing of an amended federal U.S. tax return, a taxpayer would be required to file amended state income tax returns in some or all of the states in which the taxpayer generally files. Allowing an election to claim the FDDEI sales in a subsequent year in which the third party sale occurs is analogous to the recurring item exception under §4619, which denies a current deduction for expenses paid out more than 9 months after the taxable year end (akin to the FDII filing date) but permits this deduction to be claimed in a subsequent taxable period when paid.

Example: In Year 1, DC, a domestic corporation, fabricates semiconductor wafers. The wafers are sold to a related foreign party, CFC, incorporated under the laws of foreign country X In Year 2, CFC undertakes manufacturing activities to produce a finished semiconductor product. In Year 3, CFC sells the finished semiconductor product to FC, an unrelated party incorporated under the laws of foreign country Y. CFC's sale to FC otherwise meets the requirements under §1.250(b)-4(c) and (d).

Result: CFC's sale to FC qualifies as an unrelated party transaction under §1.250(b)-6(b)(5)(ii). The unrelated party transaction described in §1.250(b)-6(b)(5)(ii) does not occur by the Year I FDII filing date. DC can elect either (a) to claim the sale to CFC on the Year 3 U.S. income tax return as an FDDEI sale or (b) to file an amended return for the Year 1 U.S. income tax return during Year 3 to claim the sale to CFC as an FDDEI sale.

DOCUMENTATION REQUIREMENTS FOR "FOREIGN PERSON"

ON Semiconductor believes that the documentation requirements under §1.250(b)-4(c)(2) to establish the status of a customer as a foreign person result in a significant administrative burden on the taxpayer. The documentation requirements to establish foreign status for all foreign customers in a manner that meets one of the prescribed forms could be especially challenging, given that a large volume of sales are concluded through a purchase order rather than an individual, specific contract.

Further, the transition period only covers the period of time up to when the Proposed Regs. are published in final form, after which companies are required to provide the additional documentation. Unfortunately, several of the items listed in §1.250(b)-4(c)(2) are not easily or quickly obtainable by ON Semiconductor in the ordinary course of business (nor would it be offered or possibly provided by the recipient). For instance, ON Semiconductor would have significant difficulty obtaining a signed letter from a customer certifying foreign status.

As proposed, absent an ability to obtain the types of documents listed, ON Semiconductor will default to "other forms of documentation as prescribed by the Secretary." In lieu of providing a restricted list which may not be flexible enough to address many different business models, ON Semiconductor recommends that Treasury amend the list of qualifying documentation to include language such as "additional documents which are utilized in the ordinary course of business, such as, but not limited to, commercial invoices, packaging slips, purchase orders, or bills of lading."

* * * * *

Thank you in advance for your consideration of these requests. ON Semiconductor supports Congress efforts to encourage IP ownership and investment in the U.S. and believes that the changes outlined above will better align the Section 250 regulations with Congressional intent. I am available to talk through any of the concerns identified above with you and your staff.

Sincerely,

Matthew E. Beckler
Vice President, Global Tax
ON Semiconductor
Phoenix, AZ

FOOTNOTES

1Front-end manufacturing uses silicon and other materials to fabricate wafers which are subject to a number of further processing steps to create "die" (e.g. electronic circuits) on the wafer.

2Back-end manufacturing, also referred to as "assembly and test activities", consists of a series of processes required to create the electrical connection necessary for the device to function. Die are attached to a frame, substrate, printed-circuit board, or other material to create a completed product referred to as a "chip". Assembly and test processes may include and/or may be referred to as: die-attach, attaching, bonding, wire-bonding, flip-chip (whereby bumps on the die make the connections), connecting, encapsulating, packaging, sealing, testing, labeling, marking, or other processes, resulting in the final product.

4To allow an orderly transition with the factory's current operations, ON Semiconductor will take possession of the factory at the end of 2022. The larger diameter wafers are referred to as either 12 inch or 300mm wafers. See SEC Form 8-K filed on April 22, 2019 for further details.

5Further, it should be noted that many sales could take place between unrelated parties in a supply chain after the sale of a finished semiconductor product by ON Semiconductor to an OEM and before it is ultimately sold to a consumer. This would further make it impractical and unreasonable to look to a consumer sale as the definition of "end user".

6ON Semiconductor (similar to other U.S. semiconductor companies) is the first link in the global electronics supply chain. In general, substantial transformation is production that results in a new and different good, which then has a name, character, use, and tariff code different from those of its constituent materials. By their very nature, semiconductors are component parts that are substantially transformed in manufacturing processes performed by unrelated parties. For example, a semiconductor may be manufactured by a taxpayer in the United States and then incorporated by an unrelated customer located in a foreign jurisdiction into a new consumer device, such as a smart phone or computer. This new device has a name, character, use, and tariff code different from those of all the rest of its constituent materials, including the semiconductor.

7See Treas. Reg. §1.954-3(a)(4).

8Reference to be aligned to the appropriate §1.250(b)-4(d) cite in the Final Regulations.

END FOOTNOTES

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